
DOW Building Solutions
Dow Building Solutions announces improved thermal conductivity for STYROFOAM-A insulation
Specifiers and contractors selecting STYROFOAM-A insulation from Dow Building Solutions will benefit from improved thermal conductivity across the product range thanks to the latest in a long history of manufacturing improvements.
Thermal conductivity of STYROFOAM-A - which includes ROOFMATE-A, FLOORMATE-A and PERIMATE DI-A products – has been improved by 0.002W/mK, enabling the construction industry to achieve lower U-values from the same thicknesses.
For example FLOORMATE 300-A – which has seen a recent boom in below-slab residential applications - now offers improved thermal conductivity of 0.033W/mK compared to a previous 0.035W/mK in a 75mm thickness.
“We’re very proud of our long history with STYROFOAM - it was invented by Dow in the 1940s and we’ve been making it at King’s Lynn since 1969,” said Jayne Law, UK and Ireland Sales Manager for Dow Building Solutions.
“Over the years we’ve always responded to market needs and legislative demands by continuing to make advances in the technical capabilities of STYROFOAM – these improvements in thermal conductivity are the latest example of our commitment to such continuous improvement.”
All STYROFOAM products offer durability, lightweight yet robust performance, high strength and excellent moisture resistance, making them ideal for below-ground and exposed roof-top insulation demands, or for areas where structural support is also required.
STYROFOAM-A materials are available in single extruded thicknesses of between 50mm and 200mm for ease of handling, and use carbon dioxide as the major blowing agent, ensuring a Global Warming Potential (GWP) of less than five.
Updated literature, product information and a stockist list can be found at www.styrofoam.co.uk. For more details contact Dow Building Solutions by email on This email address is being protected from spambots. You need JavaScript enabled to view it. and one of the account managers will be in touch.
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